H05K 3/465
By applying an insulating layer having channels for the next circuit layer
Official title: {by applying an insulating layer having channels for the next circuit layer}
H05K3/465 (By applying an insulating layer having channels for the next circuit layer) appears on 259 US grants and 291 published applications in this corpus.
Search patents in H05K- Granted patents
- 259
- Published applications
- 291
- Assignees
- 134
- Inventors
- 621
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 7 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 0 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 5 |
| 2003 | 4 | 1 |
| 2004 | 6 | 6 |
| 2005 | 5 | 12 |
| 2006 | 1 | 12 |
| 2007 | 4 | 12 |
| 2008 | 3 | 10 |
| 2009 | 7 | 17 |
| 2010 | 6 | 15 |
| 2011 | 10 | 25 |
| 2012 | 21 | 17 |
| 2013 | 11 | 15 |
| 2014 | 9 | 22 |
| 2015 | 15 | 21 |
| 2016 | 23 | 9 |
| 2017 | 7 | 9 |
| 2018 | 11 | 9 |
| 2019 | 15 | 12 |
| 2020 | 8 | 12 |
| 2021 | 9 | 8 |
| 2022 | 6 | 13 |
| 2023 | 11 | 7 |
| 2024 | 7 | 10 |
| 2025 | 3 | 4 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of producing printed circuit boards and printed circuit boards produced in accordance with the method8 Sep 2026US 12,733,108 B2Gebr. Schmid GmbH & Co.
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Transparent circuit board9 Jun 2026US 12,652,761 B2Avary Holding (Shenzhen) Co., Limited.
- Circuit board with embedded elements and method for fabricating the same26 May 2026US 12,641,730 B2Boardtek Electronics Corporation
- Component carrier with a magnetic element and a manufacturing method15 Apr 2025US 12,279,372 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring board2 Jul 2026US 2026/0190220 A1Panasonic Intellectual Property Management Co., Ltd.
- Hybrid mold, method for manufacturing hybrid mold, wiring structure, and method for manufacturing wiring structure30 Apr 2026US 2026/0122788 A1Panasonic Intellectual Property Management Co., Ltd.
- Circuit structure and manufacturing method thereof26 Mar 2026US 2026/0089837 A1Siliconware Precision Industries Co., Ltd.
- Manufacturing method of circuit board12 Mar 2026US 2026/0075720 A1Unimicron Technology Corp.
- Printed circuit board12 Feb 2026US 2026/0047009 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Selective plating method for forming integral via and wiring layers210US 5,209,817 AInternational Business Machines Corporation · 1993
- Structure having laser ablated features and method of fabricating179US 6,730,857 B2International Business Machines Corporation · 2004
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987