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US 2026/0075720 A1Published application
Manufacturing method of circuit board
AssigneeUnimicron Technology Corp.
InventorsWenHao Chen, Cho-Ying Wu
Life of this patent
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Abstract
Disclosed is a manufacturing method of a circuit board including the following steps: providing a substrate with a conductive layer; using a jig to imprint-etch the conductive layer of the substrate to form an intermediate with a concave and convex pattern; and etching the intermediate to form a circuit board with a circuit pattern, wherein the circuit pattern corresponds to a convex portion of the concave and convex pattern.
Claims10
A manufacturing method of a circuit board, comprising:
- providing a substrate with a conductive layer;
- using a jig to imprint-etch the conductive layer of the substrate to form an intermediate with a concave and convex pattern;
- and
- etching the intermediate to form a circuit board with a circuit pattern, wherein the circuit pattern corresponds to a convex portion of the concave and convex pattern.
1 more element
Dependencies are inferred from the claim text.