H05K 3/4652
Adding a circuit layer by laminating a metal foil or a preformed
Official title: {Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)}
H05K3/4652 (Adding a circuit layer by laminating a metal foil or a preformed) appears on 1,195 US grants and 1,335 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,195
- Published applications
- 1,335
- Assignees
- 407
- Inventors
- 2,461
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 6 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 10 | 0 |
| 1992 | 6 | 0 |
| 1993 | 8 | 0 |
| 1994 | 6 | 0 |
| 1995 | 14 | 0 |
| 1996 | 11 | 0 |
| 1997 | 17 | 0 |
| 1998 | 20 | 0 |
| 1999 | 28 | 0 |
| 2000 | 31 | 0 |
| 2001 | 32 | 22 |
| 2002 | 34 | 61 |
| 2003 | 49 | 57 |
| 2004 | 51 | 67 |
| 2005 | 36 | 67 |
| 2006 | 43 | 79 |
| 2007 | 44 | 64 |
| 2008 | 39 | 102 |
| 2009 | 44 | 106 |
| 2010 | 69 | 73 |
| 2011 | 63 | 63 |
| 2012 | 56 | 63 |
| 2013 | 53 | 52 |
| 2014 | 43 | 54 |
| 2015 | 30 | 36 |
| 2016 | 36 | 37 |
| 2017 | 38 | 31 |
| 2018 | 32 | 32 |
| 2019 | 36 | 54 |
| 2020 | 34 | 43 |
| 2021 | 43 | 31 |
| 2022 | 32 | 35 |
| 2023 | 21 | 36 |
| 2024 | 25 | 35 |
| 2025 | 23 | 13 |
| 2026 | 15 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Ultra thin dielectric printed circuit boards with thin laminates and method of manufacturing thereof14 Jul 2026US 12,684,704 B2Sanmina Corporation
- Method for manufacturing substrate with built-in components, and substrate with built-in components26 May 2026US 12,641,728 B2Resonac Corporation
- Component carrier19 May 2026US 12,635,073 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Integral electronic stack12 May 2026US 12,628,276 B23M Innovative Properties Company
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Component Carrier13 Aug 2026US 2026/0239534 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Laminated structure, method for producing same, cured product, and electronic component6 Aug 2026US 2026/0225131 A1Taiyo Holdings Co., Ltd.
- Glass Barrier Layer Product, and Manufacture Method30 Jul 2026US 2026/0223288 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit board structure and manufacturing method thereof23 Jul 2026US 2026/0214790 A1Unimicron Technology Corp.
Most cited
By later US patents
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991