H05K 3/4658
Characterized by laminating a prefabricated metal foil pattern
Official title: {characterized by laminating a prefabricated metal foil pattern, e.g. by transfer}
H05K3/4658 (Characterized by laminating a prefabricated metal foil pattern) appears on 101 US grants and 121 published applications in this corpus.
Search patents in H05K- Granted patents
- 101
- Published applications
- 121
- Assignees
- 64
- Inventors
- 269
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 2 |
| 2002 | 2 | 8 |
| 2003 | 9 | 7 |
| 2004 | 6 | 8 |
| 2005 | 6 | 4 |
| 2006 | 5 | 4 |
| 2007 | 5 | 2 |
| 2008 | 0 | 10 |
| 2009 | 0 | 7 |
| 2010 | 4 | 4 |
| 2011 | 3 | 9 |
| 2012 | 6 | 7 |
| 2013 | 5 | 4 |
| 2014 | 2 | 3 |
| 2015 | 2 | 4 |
| 2016 | 2 | 3 |
| 2017 | 2 | 1 |
| 2018 | 2 | 2 |
| 2019 | 1 | 3 |
| 2020 | 1 | 5 |
| 2021 | 8 | 9 |
| 2022 | 4 | 2 |
| 2023 | 3 | 4 |
| 2024 | 0 | 6 |
| 2025 | 2 | 2 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integral electronic stack12 May 2026US 12,628,276 B23M Innovative Properties Company
- Temporary carrier plate and manufacturing method thereof, and manufacturing method for packaging substrate14 Apr 2026US 12,604,414 B2Nantong Access Semiconductor Co., Ltd.
- Method for forming flipped-conductor-patch24 Mar 2026US 12,588,145 B2Microchip Technology Caldicot Limited
- Stud bumped printed circuit assembly3 Mar 2026US 12,568,576 B2
- Wiring transfer plate, wiring-equipped wiring transfer plate, wiring body intermediate material, and method for manufacturing wiring body16 Dec 2025US 12,501,554 B2Panasonic Intellectual Property Management Co., Ltd.
- Temporary carrier plate and manufacturing method thereof, and manufacturing method for packaging substrate23 Jul 2026US 2026/0214810 A1Nantong Access Semiconductor Co., Ltd.
- Stud bumped printed circuit assembly6 Nov 2025US 2025/0344319 A1LCP Medical Technologies, Inc.
- Semiconductor package and fabricating method thereof25 Sep 2025US 2025/0300052 A1AaltoSemi Inc.
- Integral electronic stack12 Dec 2024US 2024/0414845 A13M Innovative Properties Company
- Printed circuit board and manufacturing method for the same16 May 2024US 2024/0164028 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Circuit component built-in module and method for producing the same156US 6,038,133 AMatsushita Electric Industrial Co., Ltd. · 2000
- Wiring board109US 6,207,259 B1KYOCERA Corporation · 2001
- Method of manufacturing a multilayer circuit60US 5,440,805 ARogers Corporation · 1995
- Method of manufacturing printed wiring boards58US 5,865,934 AKabushiki Kaisha Toshiba · 1999
- Printed circuit board and method for producing the same58US 6,459,046 B1Matsushita Electric Industrial Co., Ltd. · 2002