Method of manufacturing printed wiring boards

A method of manufacturing a printed wiring board comprising the steps of:

• forming conductive bumps on conductive supports at predetermined positions thereof;
• interposing a synthetic resin sheet between the surfaces of the conductive supports on which the conductive bumps are formed;
• laminating the conductive supports and the synthetic resin sheet as a first laminate;
• heating the first laminate;
• pressing the first laminate at a glass transition temperature through a plasticizing temperature or a curing temperature of the resin component of the synthetic resin sheet to make the conductive bumps be inserted into the synthetic resin sheet in a direction of a sheet thickness, thereby connecting the tips of the corresponding conductive bumps with each other by using plastic deformation to form interconnections of a through-type;
• wire patterning the conductive supports;
• facing to the wire patterned surface another conductive support surface on which the conductive bumps are formed through another synthetic resin sheet to obtain a second laminate;
• heating the second laminate;
• and
• pressing the second laminate at a glass transition temperature through a plasticizing temperature or a curing temperature of the resin component of the other synthetic resin sheet to make the conductive bumps be inserted into that synthetic resin sheet in a direction of a sheet thickness, thereby connecting the tips of the corresponding conductive bumps with each other by using plastic deformation to form interconnections of a through-type.

A method of manufacturing a printed wiring board comprising the steps of:

• forming conductive bumps on supports at least at a part of predetermined positions, the supports being provided with a conductor layer as a base layer;
• interposing a synthetic resin sheet between the surfaces of the supports on which the conductive bumps are formed;
• laminating the supports and the synthetic resin sheet as a laminate;
• heating the laminate;
• and
• pressing the laminate at a glass transition temperature through a plasticizing temperature or a curing temperature of the resin component of the synthetic resin sheet to make the conductive bumps be inserted into the synthetic resin sheet in a direction of a sheet thickness, thereby connecting the tips of the corresponding conductive bumps with each other by using plastic deformation to form interconnections of a through-type.

A method of manufacturing a printed wiring board comprising the steps of:

• forming conductive bumps on conductive metal foils at predetermined positions thereof;
• interposing a synthetic resin sheet between the surfaces of the conductive metal foils on which the conductive bumps are formed;
• laminating the conductive metal foils and the synthetic resin sheet as a laminate;
• heating the laminate;
• pressing the laminate at a glass transition temperature through a plasticizing temperature or a curing temperature of the resin component of the synthetic resin sheet to make the conductive bumps be inserted into the synthetic resin sheet in a direction of a sheet thickness, thereby connecting the tips of the corresponding-conductive bumps with each other by using plastic deformation to form interconnections of a through-type;
• and
• etching the conductive metal foils of the laminate having the interconnections of the through-type formed to form wiring patterns to be connected with the interconnections of the through-type.

A method of manufacturing a printed wiring board comprising the steps of:

• forming conductive bumps on a principal surface of a conductive metal layer at predetermined positions thereof;
• facing a principal surface of a synthetic resin sheet to the principal surface of the conductive metal layer to form a laminate comprising a number of layers including an inner layer wiring pattern;
• heating the laminate;
• pressing the laminate at a glass transition temperature through a plasticizing temperature or a curing temperature of the resin component of the synthetic resin sheet to make the conductive bumps be inserted into the synthetic resin sheet in a direction of a sheet thickness, thereby connecting the conductive bumps with the inner wiring pattern on the synthetic resin sheet to form a multilayer wiring board;
• forming a through-hole for use in receiving a lead pin penetrated through the multilayer wiring board at a predetermined position;
• and
• disposing a metal layer on the inner surface of the through-hole by using a plating process.

A method of manufacturing a printed wiring board comprising the steps of:

• forming conductive bumps on a principal surface of a conductive metal layer such that a position is included in an area where a through-hole for use in receiving a lead pin is expected to be formed, a part of the position being allowed to be exposed at a number of positions on the inner surface of the expected through-hole;
• facing a principal surface of a synthetic resin sheet to the principal surface of the conductive metal layer to form a laminate comprising a number of layers including an inner layer wiring pattern;
• heating the laminate;
• pressing the laminate at a glass transition temperature through a plasticizing temperature or a curing temperature of the resin component of the synthetic resin sheet to make the conductive bumps be inserted into the synthetic resin sheet in a direction of a sheet thickness, thereby connecting the conductive bumps with the inner wiring pattern on the synthetic resin sheet to form a multilayer wiring board;
• forming the through-hole for use in receiving the lead pin penetrated through the multilayer wiring board at a predetermined position so that a part of each conductive bump is exposed in the inner surfaces;
• and
• disposing a metal layer on the inner surface of the through-hole by using a plating process.