US 6,207,259 B1 · Wiring board

Abstract

A wiring board comprising an insulating substrate containing at least an organic resin, a plurality of electrically conducting wiring layers formed on the surface and/or inside of said insulting substrate, and via-hole conductors formed in said insulating substrate in order to electrically connect the plurality of electrically conducting wiring layers, wherein said via-hole conductors contain an organic binder as well as a Cu—Sn intermetallic compound as an electrically conducting component. The via-hole conductors formed in the wiring board exhibit a high electric conductivity and a large heat resistance, making it possible to very highly reliably connect the electrically conducting wiring layers together.

Claims10

Dependent claims

A wiring board comprising:

an insulating substrate containing at least an organic resin;
a plurality of electrically conducting wire layers formed on the surface and/or inside of said insulating substrate;
via-hole conductors formed in said insulating substrate to electrically connect the plurality of electrically conducting wiring layers;
and
an organic binder and a Cu—Sn intermetallic compound as an electrically conducting component disposed within said via-hole conductors wherein a weight ratio of Sn and Cu as expressed by the formula Sn/(Cu+Sn) is between 0.25 and 0.75.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

09/428,824Filed 28 Oct 1999

Priority

JP 10-3116432 Nov 1998

Granted

27 Mar 2001

Term ends

Not estimatedThe source records don’t support an estimate.

Classification13 codes

H05K 3/4617
The electrical connections between the circuit boards being made during lamination: characterized by laminating only or mainly similar…
H05K 3/4069
By thick-film techniques: for via connections in organic insulating substrates
H05K 1/095
Dispersed materials, e.g. conductive pastes or inks: for polymer thick films, i.e. having a permanent organic polymeric binder
H05K 3/20
In which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern: by affixing…

Wiring board

Life of this patent

Wiring board

Life of this patent

Abstract

Claims10