Printed circuit board and manufacturing method for the same

A printed circuit board comprising:

• a first insulating layer;
• a first wiring layer disposed above the first insulating layer, and including a first circuit pattern and a second circuit pattern, having different thicknesses;
• and
• a second wiring layer disposed below the first insulating layer, and including a third circuit pattern having a line width, respectively wider than a line width of the first circuit pattern and a line width of the second circuit pattern.

A method for manufacturing a printed circuit board, comprising:

• forming a plurality of first metal patterns on a substrate;
• forming a metal layer covering the plurality of first metal patterns on the substrate, and including a metal, different from that of the plurality of first metal patterns;
• forming a plurality of second metal patterns on the metal layer, filling at least a portion of a space between external side surfaces of the metal layer, and including a metal, different from the metal of the metal layer, respectively;
• etching a portion of the metal layer to expose at least a portion of each of the plurality of first metal patterns from the metal layer;
• forming a first insulating layer on the plurality of first metal patterns and the plurality of second metal patterns;
• removing the substrate;
• and
• etching a remaining portion of the metal layer.

A printed circuit board comprising:

• an insulating layer;
• a first wiring layer protruding from an upper surface of the insulating layer, and including circuit patterns having different thicknesses;
• a second wiring layer disposed below the insulating layer;
• and
• a connection via passing through the insulating layer and connecting the first wiring layer and the second wiring layer to each other,
• wherein the connection via is tapered to substantially decrease a width in a direction from a surface contacting the second wiring layer to a surface contacting the first wiring layer.

A printed circuit board comprising:

• an insulating layer;
• and
• a wiring layer protruding from an upper surface of the insulating layer, and including first circuit patterns and second circuit patterns periodically disposed,
• wherein each of the first circuit patterns has one or more grooves on a side in contact with the insulating layer, and each of the second circuit patterns has one or more protrusions on a side in contact with the insulating layer.