Wiring transfer plate, wiring-equipped wiring transfer plate, wiring body intermediate material, and method for manufacturing wiring body
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTakayoshi Nirengi, Akihiro Oishi, Tsutomu Aisaka, Daisuke Matsushita, Jumpei Iwanaga, Tadashi Tojo
Life of this patent
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Abstract
A wiring transfer plate for forming wiring to be transferred to another component includes: a base; a plating base material layer formed as a release layer on the base; an insulating layer covering the base with an opening above the plating base material layer; and a projecting structure formed on the insulating layer for forming, in an insulating layer of a component to which the wiring is to be transferred, a via hole for a via electrode.
Claims4
A wiring transfer plate for forming wiring to be transferred to another component, the wiring transfer plate comprising:
- a base;
- a release layer formed on the base;
- a transfer plate insulating layer covering the base with an opening above the release layer;
- and
- a projecting structure formed on the transfer plate insulating layer, the projecting structure for forming, in an insulating layer of a component to which the wiring is to be transferred, a via hole for a via electrode.
Dependencies are inferred from the claim text.