Temporary carrier plate and manufacturing method thereof, and manufacturing method for packaging substrate

A temporary carrier plate, comprising:

• a first carrier core layer;
• a first copper foil layer on the first carrier core layer;
• a second carrier core layer on the first copper foil layer;
• and
• a second copper foil layer on the second carrier core layer,
• wherein the first copper foil layer comprises physically press-fitted first outer-layer copper foil and first inner-layer copper foil, and the second copper foil layer comprises physically press-fitted second outer-layer copper foil and second inner-layer copper foil,
• wherein a lateral dimension of the first outer-layer copper foil is less than the lateral dimension of the first inner-layer copper foil, thereby exposing a first outer edge region of the first inner-layer copper foil;
• the lateral dimension of the second outer-layer copper foil is less than the lateral dimension of the second inner-layer copper foil, thereby exposing a second outer edge region of the second inner-layer copper foil;
• wherein the lateral dimension of the second outer-layer copper foil is less than the lateral dimension of the first outer-layer copper foil such that the lateral dimension of the second outer edge region is greater than the lateral dimension of the first outer edge region.