Circuit component built-in module and method for producing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsSeiichi Nakatani, Kouichi Hirano
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Abstract
A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal plane of the insulating substrate, a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns, and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns. Thus, a highly reliable circuit component built-in module having high-density circuit components can be obtained.
Claims14
A circuit component built-in module comprising:
- an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin;
- a plurality of wiring patterns formed on at least a principal plane of the insulating substrate;
- a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns;
- and
- an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns.
Dependencies are inferred from the claim text.