Laminated structure, method for producing same, cured product, and electronic component

Abstract

The present invention provides a laminated structure capable of forming a cured product having a low roughness surface, excellent plating adhesion, and excellent heat resistance. The laminated structure of the present invention is a laminated structure comprising a first film and a resin layer provided on the first film, which is characterized by that the resin layer comprises (A) an epoxy resin, (B) a polyarylate compound having a bisphenol structure and an ester group, (C) an inorganic filler, and (D) a solvent, the (C) inorganic filler is comprised in the resin layer in an amount of 38 to 82% by mass on a solid amount basis, and the resin layer has a mass loss rate of 3.0% by mass or less after heating the resin layer at a temperature of 100° C. under atmospheric pressure for 20 minutes.

Dependencies are inferred from the claim text.