H05K 3/4655
By using a laminate characterized by the insulating layer
Official title: {by using a laminate characterized by the insulating layer (general-purpose insulating materials H05K1/03, H05K3/4673)}
H05K3/4655 (By using a laminate characterized by the insulating layer) appears on 251 US grants and 274 published applications in this corpus.
Search patents in H05K- Granted patents
- 251
- Published applications
- 274
- Assignees
- 145
- Inventors
- 715
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 9 | 0 |
| 1999 | 9 | 0 |
| 2000 | 4 | 0 |
| 2001 | 12 | 4 |
| 2002 | 8 | 15 |
| 2003 | 10 | 13 |
| 2004 | 9 | 14 |
| 2005 | 3 | 13 |
| 2006 | 7 | 7 |
| 2007 | 7 | 11 |
| 2008 | 4 | 9 |
| 2009 | 6 | 16 |
| 2010 | 7 | 11 |
| 2011 | 8 | 6 |
| 2012 | 10 | 7 |
| 2013 | 6 | 10 |
| 2014 | 7 | 8 |
| 2015 | 6 | 12 |
| 2016 | 4 | 7 |
| 2017 | 7 | 5 |
| 2018 | 7 | 11 |
| 2019 | 10 | 24 |
| 2020 | 13 | 9 |
| 2021 | 11 | 17 |
| 2022 | 14 | 11 |
| 2023 | 7 | 9 |
| 2024 | 11 | 9 |
| 2025 | 8 | 5 |
| 2026 | 5 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Glass Barrier Layer Product, and Manufacture Method30 Jul 2026US 2026/0223288 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
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Most cited
By later US patents
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998
- Circuit boards using heat resistant resin for adhesive layers88US 6,121,553 AHitachi Chemical Company, Ltd. · 2000
- Microfiber dielectrics which facilitate laser via drilling87US 6,224,965 B1Honeywell International Inc. · 2001
- Method of fabricating printed circuit board having embedded multi-layer passive devices86US 7,293,356 B2Samsung Electro-Mechanics Co., Ltd. · 2007
- Electronics module having high density interconnect structures incorporating an improved dielectric lamination adhesive75US 6,294,741 B1Lockheed Martin Corporation · 2001