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US 12,593,405 B2Granted
Circuit board and semiconductor package comprising same
AssigneeLG Innotek Co., Ltd.
InventorJae Man Bae
Life of this patent
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Abstract
A circuit board according to an embodiment includes an insulating layer including an upper and lower surface; and a through electrode passing through the upper and lower surfaces of the insulating layer and having a first inclination whose width gradually decreases toward the lower surface of the insulating layer, and wherein the through electrode includes a void portion having an inclination different from the first inclination.
Claims20
A circuit board comprising:
- an insulating layer including an upper and lower surface;
- and
- a through electrode passing through the upper and lower surfaces of the insulating layer and having a first inclination whose width gradually decreases along a vertical direction from the upper surface of the insulating layer to the lower surface of the insulating layer, and
- wherein the through electrode includes a void portion having an inclination different from the first inclination, and
- wherein the void portion includes an overlap region that overlaps the first inclination along a horizontal direction and whose width gradually increases along the vertical direction.
2 more elements
A semiconductor package comprising:
- an insulating layer including an upper and lower surface;
- a through electrode passing through the upper and lower surfaces of the insulating layer and having a first inclination whose width gradually decreases toward the lower surface of the insulating layer;
- a first pad part disposed on the upper surface of the insulating layer and connected to an upper surface of the through electrode;
- a second pad part disposed on the lower surface of the insulating layer and connected to a lower surface of the through electrode;
- and
- a semiconductor device disposed on the first pad part,
- wherein the through electrode includes a void portion having an inclination different from the first inclination, and
- wherein the void portion includes an overlap region that overlaps the first inclination along a horizontal direction and whose width gradually increases along the vertical direction.
5 more elements
Dependencies are inferred from the claim text.