Wiring board
AssigneeMurata Manufacturing Co., Ltd.
InventorsKaori Koizumi, Yuki Yamamoto
Life of this patent
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Abstract
A wiring board includes an insulating layer, a conductive layer on the insulating layer, and an interlayer connection conductor extending through the insulating layer in a lamination direction. The interlayer connection conductor is connected to the conductive layer. When a thermal expansion coefficient of the insulating layer in the lamination direction is defined as ∝z10, a thermal expansion coefficient of the interlayer connection conductor in the lamination direction is defined as ∝z30, a storage elastic modulus of the insulating layer is defined as E′10, and a storage elastic modulus of the interlayer connection conductor is defined as E′30, relationships of ∝z10>∝z30 and E′10>E′30 are satisfied in a temperature range from about −40° C. to about 85° C.
Claims18
A wiring board comprising:
- an insulating layer;
- a conductive layer on the insulating layer;
- and
- an interlayer connection conductor extending through the insulating layer in a lamination direction in which the insulating layer and the conductive layer are laminated, the interlayer connection conductor being connected to the conductive layer;
- wherein
- when a thermal expansion coefficient of the insulating layer in the lamination direction is defined as αZ10, a thermal expansion coefficient of the interlayer connection conductor in the lamination direction is defined as αZ30, a storage elastic modulus of the insulating layer is defined as E′10, and a storage elastic modulus of the interlayer connection conductor is defined as E′30, relationships of αZ10>αZ30 and E′10>E′30 are satisfied in a temperature range from about −40° C. to about 85° C.
Dependencies are inferred from the claim text.