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US 12,635,073 B2Granted
Component carrier
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorMarco Gavagnin
Life of this patent
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Abstract
Described herein are a component carrier, wherein the component carrier comprises: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, wherein at least two of said electrically conductive layer structures are connected through a plurality of (electrical) conductive nanowires.
Claims13
A component carrier, wherein the component carrier comprises:
- a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, wherein at least two of said electrically conductive layer structures are connected through a plurality of metallic nanowires;
- wherein each nanowire has two extremities, a first extremity of the two extremities being connected to a surface of one of said at least two of said electrically conductive layer structures;
- wherein the first extremity of at least one nanowire monolithically merges with the one of the electrically conductive layer structures and wherein the at least one nanowire is grown from the surface of the one of the electrically conductive layer structures;
- and
- wherein the at least one nanowire is formed from the same material as the one of the electrically conductive layer structures;
- wherein the area where the respective plurality of nanowires is provided has a planar shape with a roughness of at least the value of a nanowire diameter.
3 more elements
Dependencies are inferred from the claim text.