H05K 3/4673
Application methods or materials of intermediate insulating layers not specially adapted to
Official title: {Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28)}
H05K3/4673 (Application methods or materials of intermediate insulating layers not specially adapted to) appears on 627 US grants and 575 published applications in this corpus.
Search patents in H05K- Granted patents
- 627
- Published applications
- 575
- Assignees
- 271
- Inventors
- 1,622
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 7 | 0 |
| 1987 | 12 | 0 |
| 1988 | 9 | 0 |
| 1989 | 6 | 0 |
| 1990 | 17 | 0 |
| 1991 | 10 | 0 |
| 1992 | 24 | 0 |
| 1993 | 5 | 0 |
| 1994 | 8 | 0 |
| 1995 | 14 | 0 |
| 1996 | 16 | 0 |
| 1997 | 16 | 0 |
| 1998 | 24 | 0 |
| 1999 | 30 | 0 |
| 2000 | 18 | 0 |
| 2001 | 22 | 2 |
| 2002 | 9 | 14 |
| 2003 | 11 | 19 |
| 2004 | 14 | 20 |
| 2005 | 10 | 20 |
| 2006 | 10 | 20 |
| 2007 | 12 | 17 |
| 2008 | 5 | 15 |
| 2009 | 8 | 11 |
| 2010 | 8 | 15 |
| 2011 | 7 | 15 |
| 2012 | 12 | 8 |
| 2013 | 9 | 27 |
| 2014 | 8 | 47 |
| 2015 | 14 | 33 |
| 2016 | 35 | 25 |
| 2017 | 15 | 23 |
| 2018 | 12 | 20 |
| 2019 | 25 | 33 |
| 2020 | 24 | 29 |
| 2021 | 26 | 28 |
| 2022 | 21 | 29 |
| 2023 | 18 | 30 |
| 2024 | 27 | 37 |
| 2025 | 20 | 22 |
| 2026 | 15 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Photosensitive resin composition, dry film, printed wiring board, and method for producing printed wiring board14 Jul 2026US 12,681,386 B2Resonac Corporation
- Wiring substrate14 Jul 2026US 12,684,686 B2Ibiden Co., Ltd.
- Ultra thin dielectric printed circuit boards with thin laminates and method of manufacturing thereof14 Jul 2026US 12,684,704 B2Sanmina Corporation
- Printed wiring board2 Jun 2026US 12,648,080 B2Ibiden Co., Ltd.
- Crosstalk noise reduction by high permeability insulator2 Jun 2026US 12,648,458 B2International Business Machines Corporation
- Method and apparatus for producing a metal hybrid material with level layering over a rough base surface10 Sep 2026US 2026/0271195 A1Atlas Magnetics
- Device for forming resin laminate, circuit board, and method for forming circuit board20 Aug 2026US 2026/0247538 A1Fuji Corporation
- Circuit board manufacturing device and circuit board manufacturing method30 Jul 2026US 2026/0223294 A1NHK Spring Co., Ltd.
- Method for producing printed wiring board, photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package2 Jul 2026US 2026/0190248 A1Resonac Corporation
- Curable composition and insulating film11 Jun 2026US 2026/0159638 A1Dupont Electronics, Inc.
Most cited
By later US patents
- Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same197US 5,175,060 AIbiden Co., Ltd. · 1992
- Reworkable high density interconnect structure incorporating a release layer168US 5,434,751 AMartin Marietta Corporation · 1995
- Method for fabricating microbump interconnect for bare semiconductor dice166US 5,789,271 AMicron Technology, Inc. · 1998
- Semiconductor device having multilayered wiring structure with a small parasitic capacitance149US 5,103,288 ANEC Corporation · 1992
- Shock-resistive printed circuit board and electronic device including the same142US 6,274,821 B1Denso Corporation · 2001