H05K 3/4676
Single layer compositions
Official title: {Single layer compositions}
H05K3/4676 (Single layer compositions) appears on 406 US grants and 270 published applications in this corpus.
Search patents in H05K- Granted patents
- 406
- Published applications
- 270
- Assignees
- 190
- Inventors
- 1,025
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 7 | 0 |
| 1987 | 12 | 0 |
| 1988 | 9 | 0 |
| 1989 | 6 | 0 |
| 1990 | 17 | 0 |
| 1991 | 7 | 0 |
| 1992 | 19 | 0 |
| 1993 | 5 | 0 |
| 1994 | 7 | 0 |
| 1995 | 12 | 0 |
| 1996 | 14 | 0 |
| 1997 | 16 | 0 |
| 1998 | 23 | 0 |
| 1999 | 26 | 0 |
| 2000 | 16 | 0 |
| 2001 | 19 | 1 |
| 2002 | 7 | 11 |
| 2003 | 8 | 16 |
| 2004 | 14 | 17 |
| 2005 | 10 | 16 |
| 2006 | 10 | 17 |
| 2007 | 8 | 12 |
| 2008 | 5 | 15 |
| 2009 | 7 | 7 |
| 2010 | 7 | 10 |
| 2011 | 6 | 9 |
| 2012 | 8 | 1 |
| 2013 | 4 | 6 |
| 2014 | 4 | 22 |
| 2015 | 6 | 12 |
| 2016 | 13 | 10 |
| 2017 | 5 | 10 |
| 2018 | 5 | 9 |
| 2019 | 8 | 12 |
| 2020 | 10 | 8 |
| 2021 | 7 | 5 |
| 2022 | 7 | 8 |
| 2023 | 5 | 11 |
| 2024 | 6 | 16 |
| 2025 | 3 | 4 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed wiring board2 Jun 2026US 12,648,080 B2Ibiden Co., Ltd.
- Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board21 Apr 2026US 12,606,662 B2Resonac Corporation
- Printed wiring board3 Mar 2026US 12,568,578 B2Ibiden Co., Ltd.
- Printed wiring board10 Feb 2026US 12,550,255 B2Ibiden Co., Ltd.
- Circuit board and method of production therefor13 Jan 2026US 12,526,917 B2Denka Company Limited
- Device for forming resin laminate, circuit board, and method for forming circuit board20 Aug 2026US 2026/0247538 A1Fuji Corporation
- Method for producing printed wiring board, photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package2 Jul 2026US 2026/0190248 A1Resonac Corporation
- Curable composition and insulating film11 Jun 2026US 2026/0159638 A1Dupont Electronics, Inc.
- Curable composition and insulating film11 Jun 2026US 2026/0159720 A1Dupont Electronics, Inc.
- Photosensitive resin film, printed wiring board, and semiconductor package4 Jun 2026US 2026/0153804 A1Resonac Corporation
Most cited
By later US patents
- Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same197US 5,175,060 AIbiden Co., Ltd. · 1992
- Reworkable high density interconnect structure incorporating a release layer168US 5,434,751 AMartin Marietta Corporation · 1995
- Method for fabricating microbump interconnect for bare semiconductor dice166US 5,789,271 AMicron Technology, Inc. · 1998
- Semiconductor device having multilayered wiring structure with a small parasitic capacitance149US 5,103,288 ANEC Corporation · 1992
- Shock-resistive printed circuit board and electronic device including the same142US 6,274,821 B1Denso Corporation · 2001