Curable composition and insulating film

Abstract

The present disclosure provides a curable composition comprising: (a) maleimide resin; (b) cyanate ester; (c) polyphenylene ether oligomer; (d) thermoplastic elastomer; (e) epoxy resin; (f) curing catalyst; (g) additive; and (h) inorganic fillers, specifically boron nitride particles. The present disclosure also provides an insulating film comprising the aforementioned curable composition, which are particularly suited for manufacturing printed circuit boards (PCBs). The insulating film exhibit excellent electrical properties, including low dissipation factor (Df) and a low coefficient of thermal expansion (CTE). Furthermore, the insulating film provides significant advantages in reducing the production time in PCB manufacturing processes that involve a plasma etching step.

Dependencies are inferred from the claim text.