Shock-resistive printed circuit board and electronic device including the same
AssigneeDenso Corporation
InventorsMasashi Echigo, Kaoru Nomoto, Masayuki Aoyama, Tadao Suzuki
Life of this patent
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Abstract
A printed circuit board has a layer including a resin material, which has a tensile breaking strain of approximately 1% or more at a tensile strain rate of 40%/sec at 25° C., and an Izod impact strength of approximately 1 kgf·cm/cm or more at 25° C. Otherwise, the resin material has a peak value of dynamic loss tangent of 0.05 or more in a range of −100° C. to −50° C. by β relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0° C. to 100° C. by β′ relaxation in a dynamic viscoelasticity spectral measurement. Accordingly, thermal shock resistance and drop shock resistance of the printed circuit board can be improved.
Claims29
A printed circuit board comprising a layer including a resin material, a tensile breaking strain of which is approximately 1% or more at a tensile strain rate of 40%/sec at 25° C.
A printed circuit board comprising a layer including a resin material at a percentage content of approximately 80 wt % or more, the resin material having a peak value of dynamic loss tangent of 0.05 or more in a range of −100° C. to −50° C. by β relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0° C. to 100° C. by β′ relaxation in a dynamic viscoelasticity spectral measurement.
A printed circuit board comprising a layer formed from a resin main component, a molecule of which has a side chain including a functional group and branching from a main chain.
A printed circuit board comprising a layer formed from a setting agent, a molecule of which has a side chain branching from a main chain and including a functional group, the layer being exposed on a surface of the printed circuit board.
An electronic device comprising:
- a printed circuit board including;
- a plurality of insulation layers laminated with each other;
- a wiring pattern arranged in the plurality of insulation layers;
- and
- a layer disposed on the plurality of insulation layers to be exposed on a surface of the printed circuit board and including a resin material, the resin material having one of first and second features, the first feature being that a tensile strain of the resin material is approximately 1% or more at a tensile strain rate of 40%/sec at 25° C., the second feature being that the resin material has a peak value of dynamic loss tangent of 0.05 or more in a range of −100° C. to −50° C. by β relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0° C. to 100° C. by β′ relaxation in a dynamic viscoelasticity spectral measurement;
- and
- an electronic part disposed on the printed circuit board to be electrically connected to the wiring pattern.
An electronic device comprising:
- a printed circuit board including;
- a plurality of insulation layers laminated with each other;
- a wiring pattern arranged in the plurality of insulation layers;
- and
- a layer disposed on the plurality of insulation layers to be exposed on a surface of the printed circuit board and including a resin material, the resin material having a network structure having a plurality of bridging points of main chains, the plurality of bridging points each having at least two side chains branching therefrom;
- and
- an electronic part disposed on the printed circuit board to be electrically connected to the wiring pattern.
Dependencies are inferred from the claim text.