H05K 3/467
Adding a circuit layer by thin film methods
Official title: {Adding a circuit layer by thin film methods (H05K3/4647 takes precedence)}
H05K3/467 (Adding a circuit layer by thin film methods) appears on 232 US grants and 177 published applications in this corpus.
Search patents in H05K- Granted patents
- 232
- Published applications
- 177
- Assignees
- 135
- Inventors
- 581
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 11 | 0 |
| 1993 | 7 | 0 |
| 1994 | 2 | 0 |
| 1995 | 10 | 0 |
| 1996 | 7 | 0 |
| 1997 | 7 | 0 |
| 1998 | 0 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 12 | 4 |
| 2002 | 8 | 8 |
| 2003 | 4 | 8 |
| 2004 | 10 | 11 |
| 2005 | 4 | 2 |
| 2006 | 7 | 10 |
| 2007 | 2 | 6 |
| 2008 | 5 | 7 |
| 2009 | 2 | 4 |
| 2010 | 5 | 4 |
| 2011 | 3 | 1 |
| 2012 | 3 | 2 |
| 2013 | 3 | 1 |
| 2014 | 4 | 13 |
| 2015 | 2 | 6 |
| 2016 | 11 | 13 |
| 2017 | 13 | 10 |
| 2018 | 6 | 6 |
| 2019 | 6 | 11 |
| 2020 | 11 | 6 |
| 2021 | 6 | 15 |
| 2022 | 6 | 6 |
| 2023 | 3 | 7 |
| 2024 | 9 | 4 |
| 2025 | 3 | 6 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method thereof1 Sep 2026US 12,727,078 B2Samsung Electro-Mechanics Co., Ltd.
- Lithographic strain gauge in an electrically conducting substrate10 Mar 2026US 12,571,692 B2Microsoft Technology Licensing, LLC
- Printed wiring board18 Nov 2025US 12,477,662 B2Ibiden Co., Ltd.
- High throughput additive manufacturing for integrated circuit components containing traces with feature size and grain boundaries7 Oct 2025US 12,438,087 B2Intel Corporation
- Method of manufacture for embedded IC chip directly connected to PCB28 Jan 2025US 12,213,258 B2Averatek Corporation
- Multi-layer circuit board and processing method therefor, chip system, and electronic device24 Sep 2026US 2026/0293001 A1Huawei Technologies Co., Ltd.
- Glass Barrier Layer Product, and Manufacture Method30 Jul 2026US 2026/0223288 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Systems and methods for high-stiffness substrate integration in semiconductor packages16 Jul 2026US 2026/0206130 A1Avago Technologies International Sales Pte. Limited
- Method for manufacturing semiconductor package2 Jul 2026US 2026/0191029 A1Resonac Corporation
- Printed wiring board12 Mar 2026US 2026/0075724 A1Ibiden Co., Ltd.
Most cited
By later US patents
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Multilayer substrate112US 7,297,627 B2Medtronic MiniMed, Inc. · 2007
- Method of making a multilayer thin film structure110US 5,266,446 AInternational Business Machines Corporation · 1993
- Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board.101US 6,353,540 B1Hitachi, Ltd. · 2002
- Formation of thin film capacitors92US 6,207,522 B1MicroCoating Technologies, Inc. · 2001