Formation of thin film capacitors
AssigneeMicroCoating Technologies, Inc.
InventorsAndrew T. Hunt, Tzyy Jiuan Hwang, Helmut G. Hornis, Wen-Yi Lin
Life of this patent
Estimating the term…
Abstract
Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.
Claims11
A method of forming at least one capacitor comprising
- providing a first metal foil layer,
- depositing on said metal foil layer a dielectric material layer between about 0.03 and about 2 microns thick, and
- depositing on said dielectric material a second metal layer.
The method according to claim 26 wherein prior to depositing said second metal layer, a layer of material is deposited between about 0.001 and about 0.05 microns thick, which layer of material promotes adhesion between said dielectric material layer and said second metal layer.
A method of providing at least one thin layer capacitor comprising
- providing a polymeric support sheet,
- depositing on said support sheet a first metal layer between about 0.05 and about 3 microns thick,
- depositing on said first metal layer a dielectric material layer between about 0.03 and about 2 microns thick, and
- deposition on said dielectric material layer a second metal layer between about 0.05 and about 3 microns thick.
Dependencies are inferred from the claim text.