Method of manufacture for embedded IC chip directly connected to PCB
AssigneeAveratek Corporation
InventorsHaris Basit, Michael Riley Vinson, Shinichi Iketani
Life of this patent
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Abstract
Devices and methods for forming an electrical circuit out of a conductor embedded in two layers of substrate are disclosed. Portions of the two layers of substrate and the conductor are removed, forming a cavity through the two layers and the conductor. A blocker material is deposited along the wall of the cavity. A portion of the blocker material and adjacent layer of the substrate is removed forming another cavity in contact with a part of the conductor. A surface of the second cavity is then electroless plated by a conductive metal to form part of the electrical circuit.
Claims11
A method for manufacturing a portion of a circuit, comprising:
- depositing a first catalyst onto and in direct contact with a portion of an integrated circuit (IC), wherein the portion of the IC is an input/output (I/O) port;
- forming a first layer of dielectric material onto and in direct contact with a portion of the first catalyst, wherein the first layer of dielectric material covers the first catalyst, the IC, and the I/O port;
- forming an exposed portion of the first catalyst and depositing a first conductor over the exposed portion of the first catalyst;
- depositing a second catalyst over the first layer of dielectric material, wherein a portion of the second catalyst contacts the first conductor;
- and
- depositing a second conductor over an exposed portion of the second catalyst.
Dependencies are inferred from the claim text.