Method of making a multilayer thin film structure

A method of making a planar multilayer thin film structure on the surface of a dielectric substrate comprising the steps of:

• a. forming a multilayer thin film structure comprising the steps of:
• applying a first layer of dielectric polymeric material on a surface of a dielectric substrate,
• applying a second layer of dielectric polymeric material over the first layer of polymeric material wherein said second polymeric material is photosensitive,
• imagewise exposing and developing said second polymeric material to form a feature therein, said second layer feature in communication with at least one feature formed in said first polymeric material;
• b. filling the features in the entire multilayer structure simultaneously with conductive material by first depositing a seed layer of conductive material over the surface of said second layer and in said first and second layer features, then depositing a relatively much thicker layer of conductive material over said seed layer, said features being filled to at least the same level as said second polymeric material;
• and
• c. planarizing said multilayer thin film structure by removing the excess of the much thicker layer of conducive material.