H05K 3/4688
Composite multilayer circuits, i.e. comprising insulating layers having different properties
Official title: {Composite multilayer circuits, i.e. comprising insulating layers having different properties (having a special base or central core H05K3/4602)}
H05K3/4688 (Composite multilayer circuits, i.e. comprising insulating layers having different properties) appears on 1,494 US grants and 1,677 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,494
- Published applications
- 1,677
- Assignees
- 594
- Inventors
- 3,257
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 7 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 8 | 0 |
| 1991 | 8 | 0 |
| 1992 | 16 | 0 |
| 1993 | 11 | 0 |
| 1994 | 10 | 0 |
| 1995 | 11 | 0 |
| 1996 | 9 | 0 |
| 1997 | 13 | 0 |
| 1998 | 17 | 0 |
| 1999 | 21 | 0 |
| 2000 | 12 | 0 |
| 2001 | 16 | 11 |
| 2002 | 28 | 33 |
| 2003 | 32 | 36 |
| 2004 | 29 | 44 |
| 2005 | 22 | 56 |
| 2006 | 35 | 65 |
| 2007 | 41 | 67 |
| 2008 | 45 | 69 |
| 2009 | 33 | 89 |
| 2010 | 48 | 60 |
| 2011 | 56 | 66 |
| 2012 | 58 | 53 |
| 2013 | 54 | 40 |
| 2014 | 48 | 70 |
| 2015 | 59 | 82 |
| 2016 | 64 | 72 |
| 2017 | 59 | 61 |
| 2018 | 60 | 74 |
| 2019 | 74 | 73 |
| 2020 | 75 | 85 |
| 2021 | 74 | 97 |
| 2022 | 71 | 93 |
| 2023 | 67 | 100 |
| 2024 | 67 | 65 |
| 2025 | 74 | 58 |
| 2026 | 33 | 58 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Field device transmitter housing8 Sep 2026US 12,733,113 B2Endress + Hauser Flowtec AG
- Flexible circuit board and method of manufacturing thereof1 Sep 2026US 12,727,086 B2Avary Holding (Shenzhen) Co., Limited.
- Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate25 Aug 2026US 12,720,669 B2Murata Manufacturing Co., Ltd.
- Methods and apparatus to increase rigidity of printed circuit boards25 Aug 2026US 12,720,673 B2Intel Corporation
- Rigid-flexible printed circuit board and preparation method therefor25 Aug 2026US 12,720,686 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Microfluidic printed circuit board cooling8 Oct 2026US 2026/0313782 A1Microsoft Technology Licensing, LLC
- Circuit board and package substrate comprising same17 Sep 2026US 2026/0282243 A1LG Innotek Co., Ltd.
- Flexible lighting assemblies for lighting systems10 Sep 2026US 2026/0266436 A1Signify Holding B. V.
- Method for producing wiring board27 Aug 2026US 2026/0255472 A1Mitsui Mining & Smelting Co., Ltd.
- Circuit board and light-emitting substrate20 Aug 2026US 2026/0247767 A1Boe Technology Group Co., Ltd.
Most cited
By later US patents
- Formulation of multichip modules293US 5,239,448 AInternational Business Machines Corporation · 1993
- Foldable electronic assembly module210US 5,224,023 A1993
- High speed memory module179US 6,021,048 A2000
- Rigid-flex board with anisotropic interconnect and method of manufacture175US 5,428,190 ASheldahl, Inc. · 1995
- Shock-resistive printed circuit board and electronic device including the same142US 6,274,821 B1Denso Corporation · 2001