H05K 3/4691
Rigid-flexible multilayer circuits comprising rigid and flexible layers
Official title: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers}
H05K3/4691 (Rigid-flexible multilayer circuits comprising rigid and flexible layers) appears on 749 US grants and 803 published applications in this corpus.
Search patents in H05K- Granted patents
- 749
- Published applications
- 803
- Assignees
- 388
- Inventors
- 1,751
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 8 | 0 |
| 1991 | 5 | 0 |
| 1992 | 12 | 0 |
| 1993 | 11 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 4 | 0 |
| 1997 | 9 | 0 |
| 1998 | 11 | 0 |
| 1999 | 8 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 4 |
| 2002 | 8 | 9 |
| 2003 | 9 | 8 |
| 2004 | 6 | 8 |
| 2005 | 9 | 16 |
| 2006 | 8 | 27 |
| 2007 | 12 | 29 |
| 2008 | 21 | 37 |
| 2009 | 14 | 45 |
| 2010 | 19 | 36 |
| 2011 | 25 | 39 |
| 2012 | 33 | 35 |
| 2013 | 38 | 20 |
| 2014 | 26 | 37 |
| 2015 | 26 | 33 |
| 2016 | 32 | 28 |
| 2017 | 32 | 36 |
| 2018 | 31 | 36 |
| 2019 | 41 | 38 |
| 2020 | 42 | 53 |
| 2021 | 39 | 56 |
| 2022 | 46 | 46 |
| 2023 | 29 | 48 |
| 2024 | 36 | 24 |
| 2025 | 37 | 33 |
| 2026 | 15 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Field device transmitter housing8 Sep 2026US 12,733,113 B2Endress + Hauser Flowtec AG
- Flexible circuit board and method of manufacturing thereof1 Sep 2026US 12,727,086 B2Avary Holding (Shenzhen) Co., Limited.
- Rigid-flexible printed circuit board and preparation method therefor25 Aug 2026US 12,720,686 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Component carrier with flexible portions and manufacturing method23 Jun 2026US 12,666,531 B2AT&S Austria Technologie & Systemtechnik Aktiengsellschaft
- Packaging structure and manufacturing method thereof9 Jun 2026US 12,653,053 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Flexible lighting assemblies for lighting systems10 Sep 2026US 2026/0266436 A1Signify Holding B. V.
- Sensor module and sensor device30 Jul 2026US 2026/0219073 A1SMC Corporation
- Electronic Smoking Device Comprising a Rigidised Flexible PCB9 Jul 2026US 2026/0191260 A1JT International SA
- Stretchable rigid-flex interconnection structure with gradient stiffness9 Jul 2026US 2026/0197937 A1Agency for Science, Technology and Research
- Stretchable rigid-flex interconnector and manufacturing method therefor9 Jul 2026US 2026/0197950 A1Agency for Science, Technology and Research
Most cited
By later US patents
- Formulation of multichip modules293US 5,239,448 AInternational Business Machines Corporation · 1993
- Foldable electronic assembly module210US 5,224,023 A1993
- High speed memory module179US 6,021,048 A2000
- Rigid-flex board with anisotropic interconnect and method of manufacture175US 5,428,190 ASheldahl, Inc. · 1995
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993