Packaging structure and manufacturing method thereof

A packaging structure comprises:

• multiple packaging units comprising a hard plate region with at least four layers, a winding region with at least two layers, and a fan-out region with at least two layers, wherein the fan-out region has the same layers as the winding region and each layer of the fan-out region is connected with a layer of the hard plate region by a layer of winding region;
• wherein the at least four layers of the hard plate regions of the packaging unit are stacked, some or all of the fan-out regions are packaged with a chip, and the some or all of the fan-out regions packaged with a chip are stacked with the hard plate region after being bent by the winding region;
• wherein the packaging unit comprises a first wiring layer on each corresponding layer of the hard plate region and the winding region and the fan-out region, and the first wiring layer electrically connects the chip in the fan-out region with the hard plate region;
• wherein the packaging unit comprises copper pillars extending in a stacking direction throughout the hard plate region, and each second wiring layer is provided at each side of the hard plate region to electrically connect with each other via the copper pillar and the second wiring layers communicate with the chip in the fan-out region via the first wiring layer and the copper pillar;
• wherein each layer of the winding region or each layer of the fan-out region is detachable from each other, and at least two layers of the fan-out region detach from each other and wind in different directions relative to the hard plate region in the packaging structure.