H05K 3/4694
Partitioned multilayer circuits having adjacent regions with different properties
Official title: {Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density (H05K3/4691 takes precedence)}
H05K3/4694 (Partitioned multilayer circuits having adjacent regions with different properties) appears on 197 US grants and 257 published applications in this corpus.
Search patents in H05K- Granted patents
- 197
- Published applications
- 257
- Assignees
- 93
- Inventors
- 466
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 0 |
| 2003 | 1 | 1 |
| 2004 | 1 | 4 |
| 2005 | 1 | 6 |
| 2006 | 2 | 3 |
| 2007 | 5 | 5 |
| 2008 | 2 | 5 |
| 2009 | 3 | 8 |
| 2010 | 2 | 8 |
| 2011 | 6 | 9 |
| 2012 | 5 | 8 |
| 2013 | 5 | 11 |
| 2014 | 9 | 11 |
| 2015 | 11 | 20 |
| 2016 | 15 | 24 |
| 2017 | 15 | 11 |
| 2018 | 10 | 16 |
| 2019 | 12 | 8 |
| 2020 | 14 | 13 |
| 2021 | 9 | 17 |
| 2022 | 14 | 23 |
| 2023 | 18 | 20 |
| 2024 | 17 | 9 |
| 2025 | 10 | 9 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Printed circuit board11 Jun 2026US 2026/0164552 A1Samsung Electro-Mechanics Co., Ltd.
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board and method of manufacturing the same26 Mar 2026US 2026/0089849 A1Samsung Electro-Mechanics Co., Ltd.
- Embedded organic interposer for high bandwidth19 Mar 2026US 2026/0083016 A1Adeia Semiconductor Technologies LLC
Most cited
By later US patents
- Method for making high density substrate interconnect using inkjet printing102US 9,349,703 B2Intel Corporation · 2016
- Strain isolation structures for stretchable electronics85US 9,226,402 B2MC10, Inc. · 2015
- Packages with Si-substrate-free interposer and method forming same61US 10,522,449 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2019
- Printed wiring boards possessing regions with different coefficients of thermal expansion54US 7,301,105 B2Stablcor, Inc. · 2007
- Intermediate substrate34US 6,979,890 B2Ngk Spark Plug Co., Ltd. · 2005