Printed circuit board

Abstract

A printed circuit board includes a substrate body including a plurality of wiring layers and a plurality of via layers, wherein the plurality of wiring layers include a pair of first wiring patterns spaced apart from each other and disposed at substantially the same level as each other with respect to a thickness direction; and a first redistribution unit including one or more first redistribution layers, wherein the one or more first redistribution layers include a first redistribution pattern disposed at a level different from a level of the pair of first wiring patterns with respect to the thickness direction, wherein the first redistribution unit is embedded in the substrate body, and wherein the first redistribution pattern connects the pair of first wiring patterns to each other.

Dependencies are inferred from the claim text.