Printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Hong MIN, Eun Su KWON
Life of this patent
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Abstract
A printed circuit board includes a first build-up insulating layer; an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers; an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer; and a metal bump including a via portion penetrating the adhesive and a protrusion protruding to the upper surface of the adhesive.
Claims14
A method of manufacturing a printed circuit board, the method comprising:
- preparing a carrier substrate including a metal layer disposed on at least one surface thereof;
- forming a 1-1 build-up insulating layer on the metal layer;
- forming a cavity in the 1-1 build-up insulating layer;
- attaching an interconnect structure including one or more insulating layers, one or more wiring layers, and one or more via layers to the cavity, using an adhesive;
- forming a 1-2 build-up insulating layer burying the interconnect structure and filling at least a portion of the cavity on the 1-1 build-up insulating layer;
- separating the carrier substrate;
- removing at least a portion of the metal layer;
- and
- forming a metal bump including a via portion penetrating the adhesive and a protrusion protruding to one surface of the adhesive.
Dependencies are inferred from the claim text.