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US 9,349,703 B2Granted
Method for making high density substrate interconnect using inkjet printing
AssigneeIntel Corporation
InventorsChia-Pin Chiu, Kinya Ichikawa, Robert L. Sankman
Life of this patent
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Abstract
Generally discussed herein are systems and apparatuses that include a dense interconnect bridge and techniques for making the same. According to an example a technique can include creating a multidie substrate, printing an interconnect bridge on the multidie substrate, electrically coupling a first die to a second die by coupling the first and second dies through the interconnect bridge.
Claims10
A method of making a multidie package comprising:
- creating a multidie substrate with low density routing therein and low density interconnect pads on a surface of the substrate;
- forming a cavity in the surface of the created substrate;
- inkjet printing an interconnect bridge on the created multidie substrate, the interconnect bridge including high density routing therein and high density interconnect pads on a surface of the interconnect bridge, the high density routing including traces with a micrometer or less of space between the traces, wherein inkjet printing the interconnect bridge includes:
- inkjet printing high density traces on the substrate in the cavity,
- sintering the printed high density traces,
- inkjet printing one or more high density vias on the high density traces and in the cavity,
- sintering the one or more printed high density vias,
- inkjet printing dielectric around the sintered high density traces and sintered high density vias and in the cavity,
- inkjet printing the high density interconnect pads on the sintered high density vias, and
- sintering the printed high density interconnect pads;
- and
- electrically coupling a first die to a second die by coupling the first and second dies to the high density interconnect pads and through the interconnect bridge, wherein each of the first die and the second die at least partially overlaps with the cavity.
9 more elements
A method of making a multidie computer package comprising:
- creating a bumpless buildup layer multidie substrate with low density routing therein and low density interconnect pads on a surface of the multidie substrate;
- forming a cavity in the created multidie substrate;
- printing an interconnect bridge on the created multidie substrate, the interconnect bridge including high density routing therein and high density interconnect pads on a surface of the interconnect bridge, wherein printing the interconnect bridge includes:
- printing high density traces on the substrate in the cavity,
- sintering the printed high density traces,
- printing one or more high density vias on the high density traces and in the cavity,
- sintering the one or more printed high density vias,
- printing dielectric around the sintered high density traces and sintered high density vias and in the cavity,
- printing the high density interconnect pads on the sintered high density vias, and
- sintering the printed high density interconnect pads;
- and
- electrically coupling a memory die to a computer processor die by coupling the memory die and computer processor die to the high density interconnect pads and through the interconnect bridge, wherein each of the computer processor die and the memory die at least partially overlaps with the cavity.
9 more elements
Dependencies are inferred from the claim text.