Back to results
US 7,301,105 B2Granted
Printed wiring boards possessing regions with different coefficients of thermal expansion
AssigneeStablcor, Inc.
InventorKalu K. Vasoya
Life of this patent
Estimating the term…
Abstract
Printed wiring boards are disclosed that include regions having different coefficients of thermal expansion. In one aspect of the invention, the regions can be matched to the coefficients of thermal expansion of devices mounted on the printed wiring board. In one embodiment, the invention includes a layer including a base material and at least one insert material that are combined using a resin. In addition, the base material and insert material are located within the same plane.
Claims20
A printed wiring board comprising:
- a layer including a base material and at least one planar insert material that are combined using a resin;
- wherein the base material and planar insert material are located within the same plane;
- wherein the base material comprises the majority of the layer;
- wherein the composition of at least one of the planar insert materials is different to the composition of the base material and the resin;
- and
- wherein at least one of the insert materials includes fibers.
3 more elements
Dependencies are inferred from the claim text.