H05K 3/4611
By laminating two or more circuit boards
Official title: {by laminating two or more circuit boards (H05K3/4652 takes precedence)}
H05K3/4611 (By laminating two or more circuit boards) appears on 4,010 US grants and 3,626 published applications in this corpus.
Search patents in H05K- Granted patents
- 4,010
- Published applications
- 3,626
- Assignees
- 1,125
- Inventors
- 7,076
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 8 | 0 |
| 1978 | 8 | 0 |
| 1979 | 2 | 0 |
| 1980 | 6 | 0 |
| 1981 | 16 | 0 |
| 1982 | 15 | 0 |
| 1983 | 9 | 0 |
| 1984 | 12 | 0 |
| 1985 | 27 | 0 |
| 1986 | 23 | 0 |
| 1987 | 34 | 0 |
| 1988 | 40 | 0 |
| 1989 | 52 | 0 |
| 1990 | 37 | 0 |
| 1991 | 52 | 0 |
| 1992 | 60 | 0 |
| 1993 | 44 | 0 |
| 1994 | 69 | 0 |
| 1995 | 72 | 0 |
| 1996 | 78 | 0 |
| 1997 | 64 | 0 |
| 1998 | 110 | 0 |
| 1999 | 100 | 0 |
| 2000 | 99 | 0 |
| 2001 | 112 | 61 |
| 2002 | 137 | 189 |
| 2003 | 151 | 201 |
| 2004 | 169 | 213 |
| 2005 | 118 | 190 |
| 2006 | 130 | 199 |
| 2007 | 138 | 201 |
| 2008 | 127 | 240 |
| 2009 | 95 | 239 |
| 2010 | 156 | 171 |
| 2011 | 131 | 143 |
| 2012 | 136 | 110 |
| 2013 | 97 | 97 |
| 2014 | 95 | 129 |
| 2015 | 94 | 118 |
| 2016 | 110 | 117 |
| 2017 | 130 | 112 |
| 2018 | 109 | 115 |
| 2019 | 128 | 144 |
| 2020 | 106 | 119 |
| 2021 | 98 | 120 |
| 2022 | 110 | 108 |
| 2023 | 81 | 107 |
| 2024 | 97 | 76 |
| 2025 | 77 | 58 |
| 2026 | 29 | 49 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 3/4626Characterised by the insulating layers or materials1,746
- H05K 3/4614The electrical connections between the circuit boards being made during lamination1,220
- H05K 3/4623The circuit boards having internal via connections between two or more circuit611
- H05K 3/4641Having integrally laminated metal sheets or special power cores430
- H05K 3/4638Aligning and fixing the circuit boards before lamination191
Recent patents
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Membrane circuit board1 Sep 2026US 12,727,079 B2Chicony Electronics Co., Ltd.
- Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor18 Aug 2026US 12,709,083 B2Resonac Corporation
- Ceramic-based circuit board assemblies formed using metal nanoparticles18 Aug 2026US 12,713,527 B2Kuprion Inc.
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides1 Oct 2026US 2026/0304632 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Forming a circuit bearing structure with low temperature and pressure during lamination cycle1 Oct 2026US 2026/0304636 A1LCP Medical Technologies, Inc.
Most cited
By later US patents
- Three-dimensional multichip module systems334US 5,111,278 A1992
- Process for making active interposer for high performance packaging applications302US 6,461,895 B1Intel Corporation · 2002
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995