Ceramic-based circuit board assemblies formed using metal nanoparticles
AssigneeKuprion Inc.
InventorsAlfred A. Zinn, Khanh Nguyen
Life of this patent
Estimating the term…
Abstract
Printed circuit boards may be formed using ceramic substrates with high thermal conductivity to facilitate heat dissipation. Metal nanoparticles, such as copper nanoparticles, may be used to form conductive traces and fill through-plane vias upon the ceramic substrates. Multi-layer printed circuit boards may comprise two or more ceramic substrates adhered together, wherein each ceramic substrate has one or more conductive traces defined thereon and the one or more conductive traces are formed through consolidation of metal nanoparticles. The one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto.
Claims27
A method comprising:
- providing a ceramic substrate;
- forming one or more conductive traces upon the ceramic substrate by consolidating metal nanoparticles thereupon;
- and forming a multi-layer printed circuit board by adhering two or more ceramic substrates together;
- wherein the one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto;
- wherein the one or more conductive traces are defined upon a surface plane of the ceramic substrate and located within a groove defined upon the ceramic substrate, wherein one or more through-plane vias extend through the ceramic substrate, the one or more through-plane vias being filled with a conductive material, the method further comprising:
- filling the one or more through-plane vias with metal nanoparticles;
- and consolidating the metal nanoparticles within the one or more through-plane vias to form the conductive material therein as a metal plug.
A multi-layer printed circuit board (PCB) comprising:
- two or more ceramic substrates adhered together, each ceramic substrate having one or more conductive traces defined thereon;
- wherein the one or more conductive traces are formed through consolidation of metal nanoparticles;
- and wherein the one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto;
- wherein the one or more conductive traces are defined upon a surface plane of the ceramic substrate and located within a groove defined upon the ceramic substrate, wherein one or more through-plane vias extend through the ceramic substrate, the one or more through-plane vias being filled with a conductive material, and wherein the conductive material comprises a metal plug formed by consolidating metal nanoparticles within the one or more through-plane vias.
A method comprising:
- providing a ceramic substrate;
- forming one or more conductive traces upon the ceramic substrate by consolidating a copper nanoparticle paste composition, wherein the copper nanoparticle paste composition comprises copper nanoparticles dispersed in an organic matrix comprises one or more organic solvents;
- and forming a multi-layer printed circuit board by adhering two or more ceramic substrates together;
- wherein the one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto.
A method comprising:
- providing a ceramic substrate;
- forming one or more conductive traces upon the ceramic substrate by consolidating a copper nanoparticle paste composition, wherein the one or more conductive traces are formed upon an adhesive layer or a bonding layer in contact with the ceramic substrate;
- and forming a multi-layer printed circuit board by adhering two or more ceramic substrates together;
- wherein the one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto.
Dependencies are inferred from the claim text.