Process for making active interposer for high performance packaging applications

A method comprising:

• forming a first via hole and a second via hole in a first substrate;
• introducing conductive material over a first surface and a second surface of the first substrate;
• wherein introducing conductive material over the first surface and the second surface of the first substrate fills the first via hole to form a new via hole and a portion of the conductive material introduced over the second surface of the first substrate is removed from the second via hole forming a via through hole, wherein the depth of the new via hole is less than the depth of the first via hole and the width of the, new via through hole is less than the width of the second via hole and the conductive material comes in contact with the metal introduced on the second surface of the first substrate through the new via hole;
• forming a first circuit pattern on the introduced conductive material on the first surface and the second surface of the first substrate;
• forming solder pads on the first circuit pattern;
• attaching a dielectric to the first substrate;
• attaching an active electrical element to the first substrate with a first layer of adhesive;
• forming a hole in the first layer of adhesive to expose a contact pad of the electrical element;
• forming a via hole in a second substrate;
• introducing conductive material over a first surface and a second surface of the second substrate;
• forming a second circuit pattern on the first surface and the second surface of the second substrate;
• and
• attaching the first substrate with the second substrate, wherein the active electrical element is disposed between the first substrate and the second substrate and electrically coupled through the new via through hole.

A method comprising:

• forming a first via hole in a first substrate;
• introducing metal on a first surface and a second surface of the first substrate;
• patterning signal lines on the introduced metal on a first surface and a second surface of the first substrate;
• attaching a dielectric to the first surface of the first substrate, wherein the dielectric is in contact with the signal lines and the first surface of the first substrate;
• electronically connecting a portion of the signal lines of the first substrate and the dielectric;
• attaching an active electrical element to the first surface of the first substrate with a first layer of adhesive;
• removing a portion of the active electrical element to reduce the thickness of the active electrical element;
• forming a second via hole in a second substrate;
• introducing metal on a first surface and a second surface of the second substrate;
• patterning signal lines on the introduced metal on the first surface and the second surface of the second substrate;
• and
• attaching the second substrate to the first substrate with a second layer of adhesive, wherein the active electrical element is covered by the adhesive.