H05K 3/4638

Aligning and fixing the circuit boards before lamination

Official title: {Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits}

H05K3/4638 (Aligning and fixing the circuit boards before lamination) appears on 191 US grants and 161 published applications in this corpus.

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Granted patents
191
Published applications
161
Assignees
144
Inventors
456
Latest grant
24 Jun 2025

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H05K 3/4638: granted patents and published applications per publication year
YearGranted patentsPublished applications
197810
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198010
198110
198220
198300
198410
198540
198610
198720
198810
198900
199040
199150
199230
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199540
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199700
199860
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200090
200164
200248
200388
2004610
200568
200654
200728
200835
200918
201015
201144
201226
2013210
201469
2015117
2016910
201774
201859
201954
2020106
202156
202255
202375
202441
202524
202603

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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