Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides

A method of manufacturing a component carrier, the method comprising:

• providing a stack having a central portion comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
• embedding at least one electronic component in the central portion of the stack;
• and
• forming an electrically and thermally conductive first layer structure on one side of the central portion and an electrically and thermally conductive second layer structure on an opposing other side of the central portion, each of the first layer structure and the second layer structure having a thickness higher than a thickness of the at least one electrically conductive layer structure of the central portion.