H05K 3/4623
The circuit boards having internal via connections between two or more circuit
Official title: {the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards (H05K3/462 takes precedence)}
H05K3/4623 (The circuit boards having internal via connections between two or more circuit) appears on 611 US grants and 526 published applications in this corpus.
Search patents in H05K- Granted patents
- 611
- Published applications
- 526
- Assignees
- 247
- Inventors
- 1,267
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 8 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 14 | 0 |
| 1995 | 11 | 0 |
| 1996 | 21 | 0 |
| 1997 | 16 | 0 |
| 1998 | 26 | 0 |
| 1999 | 17 | 0 |
| 2000 | 17 | 0 |
| 2001 | 24 | 20 |
| 2002 | 25 | 29 |
| 2003 | 24 | 26 |
| 2004 | 30 | 35 |
| 2005 | 20 | 29 |
| 2006 | 22 | 23 |
| 2007 | 16 | 23 |
| 2008 | 14 | 26 |
| 2009 | 12 | 28 |
| 2010 | 20 | 16 |
| 2011 | 15 | 18 |
| 2012 | 13 | 17 |
| 2013 | 13 | 11 |
| 2014 | 3 | 10 |
| 2015 | 8 | 15 |
| 2016 | 11 | 20 |
| 2017 | 21 | 10 |
| 2018 | 17 | 16 |
| 2019 | 16 | 19 |
| 2020 | 9 | 23 |
| 2021 | 20 | 24 |
| 2022 | 32 | 25 |
| 2023 | 12 | 22 |
| 2024 | 24 | 21 |
| 2025 | 20 | 10 |
| 2026 | 9 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Circuit board with a plurality of laminated insulating layers having conductive paste filled vias and manufacturing method thereof23 Jun 2026US 12,666,546 B2Fict Limited
- Method of manufacturing circuit board12 May 2026US 12,628,282 B2Avary Holding (Shenzhen) Co., Limited.
- Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the same7 Apr 2026US 12,598,707 B2Tse Co., Ltd.
- Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides1 Oct 2026US 2026/0304632 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Power conversion apparatus, system card, manufacturing method for an integrated capacitor substrate and power supply module25 Jun 2026US 2026/0178089 A1MetaPWR Electronics Co., Ltd.
- Circuit board, method for manufacturing circuit board, and electronic device25 Jun 2026US 2026/0182474 A1Fict Limited
- Printed circuit board11 Jun 2026US 2026/0164554 A1Samsung Electro-Mechanics Co., Ltd.
- Integrated printed circuit board with light guide layer7 May 2026US 2026/0129749 A1Toyota Jidosha Kabushiki Kaisha
Most cited
By later US patents
- Three-dimensional multichip module systems334US 5,111,278 A1992
- Process for making active interposer for high performance packaging applications302US 6,461,895 B1Intel Corporation · 2002
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Method for producing multilayer printed wiring boards247US 5,258,094 ANEC Corporation · 1993