H05K 3/4641
Having integrally laminated metal sheets or special power cores
Official title: {having integrally laminated metal sheets or special power cores}
H05K3/4641 (Having integrally laminated metal sheets or special power cores) appears on 430 US grants and 293 published applications in this corpus.
Search patents in H05K- Granted patents
- 430
- Published applications
- 293
- Assignees
- 162
- Inventors
- 695
- Latest grant
- 27 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 9 | 0 |
| 1990 | 8 | 0 |
| 1991 | 3 | 0 |
| 1992 | 7 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 8 | 0 |
| 1996 | 11 | 0 |
| 1997 | 10 | 0 |
| 1998 | 20 | 0 |
| 1999 | 14 | 0 |
| 2000 | 12 | 0 |
| 2001 | 28 | 14 |
| 2002 | 28 | 26 |
| 2003 | 18 | 25 |
| 2004 | 31 | 17 |
| 2005 | 15 | 28 |
| 2006 | 17 | 34 |
| 2007 | 22 | 20 |
| 2008 | 22 | 40 |
| 2009 | 15 | 21 |
| 2010 | 26 | 24 |
| 2011 | 13 | 13 |
| 2012 | 20 | 5 |
| 2013 | 5 | 6 |
| 2014 | 4 | 3 |
| 2015 | 5 | 0 |
| 2016 | 5 | 2 |
| 2017 | 1 | 0 |
| 2018 | 2 | 1 |
| 2019 | 0 | 4 |
| 2020 | 2 | 1 |
| 2021 | 2 | 1 |
| 2022 | 2 | 2 |
| 2023 | 1 | 2 |
| 2024 | 3 | 1 |
| 2025 | 1 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Light-emitting module with compact converter circuit27 May 2025US 12,313,249 B2Valeo Vision
- Ceramic substrate manufacturing method1 Oct 2024US 12,108,540 B2Amosense Co., Ltd.
- Circuit board with heat dissipation structure and method for manufacturing same7 May 2024US 11,979,977 B2Avary Holding (Shenzhen) Co., Limited.
- Multilayer wiring substrate2 Jan 2024US 11,864,313 B2Murata Manufacturing Co., Ltd.
- Multilayer copper bus bars with soldered through hole components28 Nov 2023US 11,832,390 B2ROLLS-ROYCE plc
- Method of manufacturing multilayer pcb for semiconductor testing and multilayer pcb manufactured thereby27 Aug 2026US 2026/0255494 A1Tes Co., Ltd
- Laminated substrate and method for manufacturing the same28 May 2026US 2026/0150196 A1Monolithic Power Systems, Inc.
- Methods for promoting selective copper foil adhesion in a printed circuit board8 May 2025US 2025/0151205 A1Rockwell Collins, Inc.
- Light-emitting module with compact converter circuit1 Aug 2024US 2024/0255132 A1Valeo Vision
- Multilayer copper bus bars with soldered through hole components7 Sep 2023US 2023/0284387 A1ROLLS-ROYCE plc
Most cited
By later US patents
- Metal base package for a semiconductor device195US 5,866,942 ANEC Corporation · 1999
- Double-sided hybrid high density circuit board and method of making same180US 5,072,075 ADigital Equipment Corporation · 1991
- Plastic pin grid array package175US 5,102,829 AAT&T Bell Laboratories · 1992
- In situ method for forming a capacitive PCB173US 5,261,153 AZycon Corporation · 1993
- Card-type electronic device with plastic frame sandwiched between printed circuit boarding metal panel150US 5,784,259 ASeiko Epson Corporation · 1998