Multilayer copper bus bars with soldered through hole components

A multi-layer bus bar assembly comprising,

• a capacitor having a body and a first electrical connection pin that extends away from the body along an axis,
• a multi-layer bus bar that includes
• a positive rail that includes a plurality of first conductive layers and a plurality of first inter-insulation layers, wherein each of the plurality of first inter-insulation layers is located axially between neighboring first conductive layers included in the plurality of first conductive layers,
• a negative rail that includes a plurality of second conductive layers and a plurality of second inter-insulation layers, wherein each of the plurality of second inter-insulation layers is located axially between neighboring second conductive, and
• a main insulation layer positioned between the positive rail and the negative rail,
• wherein the plurality of first conductive layers are formed to assist in the joining of the plurality of first conductive layers with the first electrical connection pin, the plurality of first conductive layers include a first layer and a second layer axially neighboring the first layer, the first layer formed to define a first cutout shaped with a soldering pattern arranged about the axis, and the second layer formed to define a second cutout shaped with the soldering pattern, and
• wherein the soldering pattern includes a first portion that extends circumferentially at least partway around the first electrical connection pin at a first radial distance relative to the axis and a second portion that extends circumferentially at least partway about the first electrical connection pin at a second radial distance relative to the axis.