Circuit board with heat dissipation structure and method for manufacturing same

A method for manufacturing a circuit board with a heat dissipation structure, comprising:

• providing two wiring base boards, each of the wiring base boards comprising a first conductor layer, an insulation layer, and an alloy layer stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface, and the solder paste layer is disposed around the thermal conductive surface;
• providing a core layer;
• and
• pressing the two wiring base boards on two opposite sides of the core layer, the solder paste layers of the two wiring base boards being connected to each other, the solder paste layers and the thermal conductive surfaces of the two wiring base boards together forming a sealed heat dissipating chamber, the heat dissipating chamber being provided with a heat transfer medium therein, thereby obtaining the circuit board, wherein the insulation layer is provided with a first thermal conductive element connecting the first conductor layer and the alloy layer, the first conductor layer, the first thermal conductive element, the alloy layer, and the heat dissipating chamber together form a heat transfer path.