H05K 3/4626
Characterised by the insulating layers or materials
Official title: {characterised by the insulating layers or materials (H05K3/4688 takes precedence)}
H05K3/4626 (Characterised by the insulating layers or materials) appears on 1,746 US grants and 1,598 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,746
- Published applications
- 1,598
- Assignees
- 516
- Inventors
- 3,497
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 4 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 8 | 0 |
| 1982 | 11 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 12 | 0 |
| 1986 | 10 | 0 |
| 1987 | 8 | 0 |
| 1988 | 21 | 0 |
| 1989 | 26 | 0 |
| 1990 | 16 | 0 |
| 1991 | 27 | 0 |
| 1992 | 35 | 0 |
| 1993 | 19 | 0 |
| 1994 | 36 | 0 |
| 1995 | 33 | 0 |
| 1996 | 30 | 0 |
| 1997 | 36 | 0 |
| 1998 | 40 | 0 |
| 1999 | 45 | 0 |
| 2000 | 36 | 0 |
| 2001 | 40 | 17 |
| 2002 | 59 | 79 |
| 2003 | 54 | 89 |
| 2004 | 76 | 82 |
| 2005 | 43 | 87 |
| 2006 | 46 | 73 |
| 2007 | 56 | 81 |
| 2008 | 50 | 82 |
| 2009 | 45 | 104 |
| 2010 | 63 | 86 |
| 2011 | 52 | 67 |
| 2012 | 63 | 53 |
| 2013 | 48 | 50 |
| 2014 | 46 | 65 |
| 2015 | 47 | 55 |
| 2016 | 46 | 50 |
| 2017 | 51 | 57 |
| 2018 | 56 | 54 |
| 2019 | 65 | 77 |
| 2020 | 50 | 55 |
| 2021 | 45 | 60 |
| 2022 | 47 | 48 |
| 2023 | 41 | 46 |
| 2024 | 36 | 28 |
| 2025 | 36 | 30 |
| 2026 | 10 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Ceramic-based circuit board assemblies formed using metal nanoparticles18 Aug 2026US 12,713,527 B2Kuprion Inc.
- Method for manufacturing wiring board14 Jul 2026US 12,684,697 B2Fujikura Printed Circuits Ltd.
- Circuit board with a plurality of laminated insulating layers having conductive paste filled vias and manufacturing method thereof23 Jun 2026US 12,666,546 B2Fict Limited
- Integrated circuit optical package comprising a flexible electrical connection element12 May 2026US 12,628,272 B2STMicroelectronics (Grenoble 2) SAS
- Wiring board12 May 2026US 12,628,274 B2KYOCERA Corporation
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Forming a circuit bearing structure with low temperature and pressure during lamination cycle1 Oct 2026US 2026/0304636 A1LCP Medical Technologies, Inc.
- Inlay, Component Carrier, and Method of Manufacturing the Inlay17 Sep 2026US 2026/0282220 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit board and manufacturing method thereof27 Aug 2026US 2026/0255475 A1Avary Holding (Shenzhen) Co., Limited.
- Wiring board, electronic-component-mounting package using wiring board, and electronic module16 Jul 2026US 2026/0206127 A1KYOCERA Corporation
Most cited
By later US patents
- Integrated multilayered microfludic devices and methods for making the same242US 6,572,830 B1Motorola, Inc. · 2003
- Multilayered microfluidic DNA analysis system and method238US 6,544,734 B12003
- Capacitive filtered feedthrough array for an implantable medical device220US 6,414,835 B1Medtronic, Inc. · 2002
- Capacitive filtered feedthrough array for an implantable medical device178US 6,660,116 B2Medtronic, Inc. · 2003
- Distributed constant circuit board using ceramic substrate material148US 5,232,765 ANGK Insulators, Ltd. · 1993