H05K 3/4629
Laminating inorganic sheets comprising printed circuits
Official title: {laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets}
H05K3/4629 (Laminating inorganic sheets comprising printed circuits) appears on 974 US grants and 786 published applications in this corpus.
Search patents in H05K- Granted patents
- 974
- Published applications
- 786
- Assignees
- 243
- Inventors
- 1,827
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 7 | 0 |
| 1982 | 10 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 11 | 0 |
| 1986 | 9 | 0 |
| 1987 | 6 | 0 |
| 1988 | 12 | 0 |
| 1989 | 18 | 0 |
| 1990 | 11 | 0 |
| 1991 | 19 | 0 |
| 1992 | 25 | 0 |
| 1993 | 11 | 0 |
| 1994 | 20 | 0 |
| 1995 | 20 | 0 |
| 1996 | 20 | 0 |
| 1997 | 28 | 0 |
| 1998 | 33 | 0 |
| 1999 | 33 | 0 |
| 2000 | 26 | 0 |
| 2001 | 33 | 13 |
| 2002 | 39 | 47 |
| 2003 | 35 | 48 |
| 2004 | 43 | 45 |
| 2005 | 20 | 43 |
| 2006 | 27 | 42 |
| 2007 | 28 | 38 |
| 2008 | 28 | 43 |
| 2009 | 24 | 68 |
| 2010 | 36 | 54 |
| 2011 | 32 | 36 |
| 2012 | 43 | 22 |
| 2013 | 24 | 31 |
| 2014 | 26 | 32 |
| 2015 | 17 | 18 |
| 2016 | 18 | 14 |
| 2017 | 19 | 23 |
| 2018 | 12 | 27 |
| 2019 | 31 | 39 |
| 2020 | 17 | 24 |
| 2021 | 18 | 20 |
| 2022 | 18 | 13 |
| 2023 | 13 | 18 |
| 2024 | 14 | 9 |
| 2025 | 18 | 14 |
| 2026 | 4 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Ceramic-based circuit board assemblies formed using metal nanoparticles18 Aug 2026US 12,713,527 B2Kuprion Inc.
- Wiring board12 May 2026US 12,628,274 B2KYOCERA Corporation
- Package having thick glass core with high aspect ratio vias17 Feb 2026US 12,557,211 B2Intel Corporation
- Ion thruster and method for fabrication thereof10 Feb 2026US 12,546,295 B2
- Method for manufacturing printed wiring board30 Dec 2025US 12,513,828 B2Ibiden Co., Ltd.
- Wiring board, electronic-component-mounting package using wiring board, and electronic module16 Jul 2026US 2026/0206127 A1KYOCERA Corporation
- Composite substrate25 Jun 2026US 2026/0181770 A1Murata Manufacturing Co., Ltd.
- Ceramic substrate and electronic component26 Mar 2026US 2026/0089838 A1Murata Manufacturing Co., Ltd.
- Wiring board and method of manufacturing the same12 Feb 2026US 2026/0047002 A1
- Microelectronic Packaging Using Circuits on Glass and Stacking Glass Circuits5 Feb 2026US 2026/0040463 A1Sciperio, Inc
Most cited
By later US patents
- Integrated multilayered microfludic devices and methods for making the same242US 6,572,830 B1Motorola, Inc. · 2003
- Multilayered microfluidic DNA analysis system and method238US 6,544,734 B12003
- Capacitive filtered feedthrough array for an implantable medical device220US 6,414,835 B1Medtronic, Inc. · 2002
- Capacitive filtered feedthrough array for an implantable medical device178US 6,660,116 B2Medtronic, Inc. · 2003
- Distributed constant circuit board using ceramic substrate material148US 5,232,765 ANGK Insulators, Ltd. · 1993