Distributed constant circuit board using ceramic substrate material

A distributed constant circuit board, comprising:

• a ceramic substrate consisting essentially of a ceramic composition including at least 5% by weight of TiO.sub.2 powder, wherein particles of said TiO.sub.2 powder are dispersed in said ceramic substrate;
• and
• a microwave integrated circuit buried in said ceramic substrate, said microwave integrated circuit forming at least one of a resonance circuit, an inductor, a capacitor and a strip transmission line and having a major component selected from the group consisting of Ag, Au and Cu, said microwave integrated circuit having a sheet resistivity not higher than 10 m.OMEGA. per square;
• wherein
• said ceramic composition of said ceramic substrate yields a temperature coefficient between -30 ppm/.degree. C. and +100 ppm/.degree. C. of such a resonance circuit, said microwave integrated circuit is co-fired with a green sheet of said ceramic substrate, and a sintering temperature of the ceramic substrate is not higher than 1100.degree. C.