H05K 3/4632
Laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive
Official title: {laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets}
H05K3/4632 (Laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive) appears on 240 US grants and 268 published applications in this corpus.
Search patents in H05K- Granted patents
- 240
- Published applications
- 268
- Assignees
- 76
- Inventors
- 500
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 4 | 0 |
| 1994 | 8 | 0 |
| 1995 | 5 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 8 |
| 2003 | 3 | 11 |
| 2004 | 11 | 15 |
| 2005 | 6 | 9 |
| 2006 | 7 | 7 |
| 2007 | 10 | 4 |
| 2008 | 9 | 10 |
| 2009 | 0 | 6 |
| 2010 | 6 | 6 |
| 2011 | 6 | 7 |
| 2012 | 2 | 12 |
| 2013 | 7 | 5 |
| 2014 | 6 | 11 |
| 2015 | 8 | 18 |
| 2016 | 7 | 17 |
| 2017 | 13 | 14 |
| 2018 | 24 | 15 |
| 2019 | 16 | 16 |
| 2020 | 19 | 13 |
| 2021 | 9 | 17 |
| 2022 | 10 | 11 |
| 2023 | 15 | 12 |
| 2024 | 5 | 8 |
| 2025 | 10 | 7 |
| 2026 | 2 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing wiring board14 Jul 2026US 12,684,697 B2Fujikura Printed Circuits Ltd.
- Multilayer substrate and method of manufacturing multilayer substrate24 Feb 2026US 12,563,677 B2Murata Manufacturing Co., Ltd.
- Resin film with conductor layer, multilayer substrate, and method for producing resin film with conductor layer23 Dec 2025US 12,507,340 B2Murata Manufacturing Co., Ltd.
- Multilayer board, electronic device, and multilayer board inspection method21 Oct 2025US 12,451,284 B2Murata Manufacturing Co., Ltd.
- Multilayer substrate and manufacturing method therefor30 Sep 2025US 12,431,603 B2Murata Manufacturing Co., Ltd.
- Multilayer substrate9 Jul 2026US 2026/0197932 A1Murata Manufacturing Co., Ltd.
- Circuit board, method for manufacturing circuit board, and electronic device25 Jun 2026US 2026/0182474 A1Fict Limited
- Multilayer substrate module and electronic device4 Jun 2026US 2026/0156755 A1Murata Manufacturing Co., Ltd.
- Method for manufacturing wiring board, and wiring board9 Apr 2026US 2026/0101445 A1Fujikura Printed Circuits Ltd.
- Resin laminated board and method for manufacturing resin laminated board26 Mar 2026US 2026/0089834 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Method of manufacturing a multilayer circuit board138US 5,046,238 ARogers Corporation · 1991
- Electrical device mounting wiring board and method of producing the same100US 6,359,235 B1KYOCERA Corporation · 2002
- Multi-layered interconnect structure using liquid crystalline polymer dielectric96US 7,301,108 B2International Business Machines Corporation · 2007
- Method of manufacturing a multilayer circuit board92US 5,329,695 ARogers Corporation · 1994
- Monolithic LCP polymer microelectronic wiring modules72US 5,719,354 AHoechst Celanese Corporation · 1998