Electrical device mounting wiring board and method of producing the same
AssigneeKYOCERA Corporation
InventorKatsura Hayashi
Life of this patent
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Abstract
An electronic device mounting wiring board having an electronic device mounted on the surface of a wiring substrate or inside thereof is provided. The wiring substrate includes an insulation substrate made by laminating a plurality of insulation layers that include a thermosetting resin, a wiring circuit layer formed on the surface of and inside of the insulation substrate and via hole conductors. A resin layer having a glass transition temperature lower than the curing temperature of the thermosetting resin is formed between at least one of top and bottom surfaces of the electrical device and the insulation layer.
Claims10
An electrical device mounting wiring board, comprising:
- a wiring board including an insulation substrate made by laminating a plurality of insulation layers that contain a thermosetting resin, wiring circuit layers formed on the surface of and inside of the insulation substrate and via hole conductors;
- an electrical device, that has electrodes electrically connected to the via hole conductors or the wiring circuit layer and is incorporated inside of the wiring substrate;
- and
- a resin layer having a glass transition temperature lower than a curing temperature of the thermosetting resin and is formed between at least one of top and bottom surfaces of the electrical device and the insulation layer.
Dependencies are inferred from the claim text.