Multilayer substrate and manufacturing method therefor

A multilayer substrate comprising:

• a multilayer body including a plurality of insulating layers stacked on each other in an up-down direction;
• a first conductive layer on one of a top main surface or a bottom main surface of one of the plurality of insulating layers, a first signal being transmitted through the first conductive layer;
• a second conductive layer on the one of the top main surface or a bottom main surface of the one of the plurality of insulating layers, a second signal having a higher frequency than the first signal being transmitted through the second conductive layer;
• and
• a top conductive layer on the multilayer body and provided above the first and second conductive layers so as to overlap the second conductive layer as viewed in the up-down direction;
• wherein
• a thickness of the second conductive layer in the up-down direction is smaller than a thickness of the first conductive layer in the up-down direction;
• the top conductive layer is closer to the first conductive layer and the second conductive layer than any other conductive layers in the up-down direction;
• and
• the top conductive layer overlaps the first conductive layer and the second conductive layer as viewed in the up-down direction.

A multilayer substrate comprising:

• a main body including an insulating material;
• a first conductive layer in or on the main body, a first signal being transmitted through the first conductive layer;
• a second conductive layer in or on the main body, a second signal having a higher frequency than the first signal being transmitted through the second conductive layer;
• and
• a top conductive layer in or on the main body and provided above the first and second conductive layers so as to overlap the second conductive layer as viewed in the up-down direction;
• wherein
• the second conductive layer overlaps the first conductive layer in a direction perpendicular or substantially perpendicular to a transmitting direction of the first signal;
• a thickness of the second conductive layer in the up-down direction is smaller than a thickness of the first conductive layer in the up-down direction;
• the top conductive layer is closer to the first conductive layer and the second conductive layer than any other conductive layers in the up-down direction;
• and
• a distance between the second conductive layer and the top conductive layer in the up-down direction is larger than a distance between the first conductive layer and the top conductive layer in the up-down direction.

A multilayer substrate comprising:

• a main body including an insulating material;
• a first conductive layer in or on the main body, a first signal being transmitted through the first conductive layer;
• a second conductive layer in or on the main body, a second signal having a higher frequency than the first signal being transmitted through the second conductive layer;
• and
• a top conductive layer in or on the main body and provided above the first and second conductive layers so as to overlap the second conductive layer as viewed in the up-down direction;
• wherein
• the second conductive layer overlaps the first conductive layer in a direction perpendicular or substantially perpendicular to a transmitting direction of the first signal;
• a thickness of the second conductive layer in the up-down direction is smaller than a thickness of the first conductive layer in the up-down direction;
• the top conductive layer is closer to the first conductive layer and the second conductive layer than any other conductive layers in the up-down direction;
• and
• the top conductive layer overlaps the first conductive layer and the second conductive layer as viewed in the up-down direction.