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AssigneeMurata Manufacturing Co., Ltd.
InventorsShohei SAKAI, Kosuke NISHIO
Estimating the term…
A resin laminated board includes resin layers laminated on one another and conductors located outside and inside the laminated resin layers. The resin layers include a first resin layer, a second resin layer, and a third resin layer sequentially laminated on one another. The conductors include first conductor layers, second conductor layers, and interlayer connection conductors. The first conductor layers are located at a lower main surface of the first resin layer. The second conductor layers or the interlayer connection conductors that overlap a portion of the first resin layer when viewed in a thickness direction of the third resin layer are located at the third resin layer. The second resin layer is a thermoplastic resin, and a melting point of the second resin layer is lower than a melting point of the first resin layer. At least the second resin layer includes air bubbles.
A resin laminated board, comprising:
A method for manufacturing a resin laminated board including a plurality of resin layers laminated on one another and conductors located outside and inside the laminated plurality of resin layers, the plurality of resin layers including a first resin layer, a second resin layer, and a third resin layer sequentially laminated on one another, the conductors including a first conductor layer, a second conductor layer, and an interlayer connection conductor, the first resin layer including an upper main surface and a lower main surface opposite to each other, the second resin layer including an upper main surface and a lower main surface opposite to each other, the upper main surface of the first resin layer being in contact with the lower main surface of the second resin layer, the first conductor layer being located at the lower main surface of the first resin layer, the second conductor layer or the interlayer connection conductor that overlaps a portion of the first conductor layer when viewed in a thickness direction of the third resin layer being located at the third resin layer, the second resin layer being a thermoplastic resin including air bubbles inside before being subjected to thermal pressing, and a melting point of the second resin layer being lower than a melting point of the first resin layer, the method comprising:
Dependencies are inferred from the claim text.