H05K 3/4635
Laminating flexible circuit boards using additional insulating adhesive materials between the boards
Official title: {laminating flexible circuit boards using additional insulating adhesive materials between the boards}
H05K3/4635 (Laminating flexible circuit boards using additional insulating adhesive materials between the boards) appears on 223 US grants and 227 published applications in this corpus.
Search patents in H05K- Granted patents
- 223
- Published applications
- 227
- Assignees
- 149
- Inventors
- 573
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 5 | 0 |
| 1993 | 1 | 0 |
| 1994 | 6 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 5 | 6 |
| 2003 | 4 | 7 |
| 2004 | 7 | 2 |
| 2005 | 6 | 8 |
| 2006 | 4 | 10 |
| 2007 | 3 | 11 |
| 2008 | 4 | 12 |
| 2009 | 5 | 3 |
| 2010 | 7 | 10 |
| 2011 | 4 | 10 |
| 2012 | 3 | 9 |
| 2013 | 6 | 5 |
| 2014 | 4 | 14 |
| 2015 | 12 | 12 |
| 2016 | 9 | 7 |
| 2017 | 9 | 13 |
| 2018 | 10 | 8 |
| 2019 | 14 | 12 |
| 2020 | 11 | 11 |
| 2021 | 9 | 15 |
| 2022 | 14 | 17 |
| 2023 | 4 | 10 |
| 2024 | 12 | 4 |
| 2025 | 5 | 5 |
| 2026 | 2 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board with a plurality of laminated insulating layers having conductive paste filled vias and manufacturing method thereof23 Jun 2026US 12,666,546 B2Fict Limited
- Integrated circuit optical package comprising a flexible electrical connection element12 May 2026US 12,628,272 B2STMicroelectronics (Grenoble 2) SAS
- Manufacturing method of electronic device and electronic device4 Nov 2025US 12,464,652 B2Innolux Corporation
- Transmission line and electronic device7 Oct 2025US 12,438,246 B2Murata Manufacturing Co., Ltd.
- Transmission line and electronic device7 Oct 2025US 12,438,247 B2Murata Manufacturing Co., Ltd.
- Circuit board and manufacturing method thereof27 Aug 2026US 2026/0255475 A1Avary Holding (Shenzhen) Co., Limited.
- Superconducting flexible interconnect9 Jul 2026US 2026/0196387 A1All Flex Solutions, Inc.
- Stretchable rigid-flex interconnection structure with gradient stiffness9 Jul 2026US 2026/0197937 A1Agency for Science, Technology and Research
- Stretchable rigid-flex interconnector and manufacturing method therefor9 Jul 2026US 2026/0197950 A1Agency for Science, Technology and Research
- Flexible Printed Circuit and Electronic Device18 Jun 2026US 2026/0173258 A1Honor Device Co., Ltd.
Most cited
By later US patents
- Semiconductor device and method for manufacturing substrate of the same147US 6,351,031 B1Fujitsu Limited · 2002
- Flexible multilayer printed circuit boards and methods of manufacture97US 5,527,998 ASheldahl, Inc. · 1996
- Manufacturing miniature hearing aid having a multi-layer circuit arrangement77US 4,783,815 ASiemens Aktiengesellschaft · 1988
- Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing T.sub.G ' s61US 5,157,589 AGeneral Electric Company · 1992
- Flexible printed substrate61US 5,374,469 ANitto Denko Corporation · 1994