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AssigneeNitto Denko Corporation
InventorsAtsushi Hino, Amane Mochizuki, Kazuo Ouchi, Shoji Morita, Toshiki Naito, Kazumi Higashi, Masako Maeda, Masayuki Kaneto, Munekazu Tanaka, Masakazu Sugimoto
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A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.
A flexible printed substrate comprising an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region comprising low-linear expansion polyimide resin and thermoplastic polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.
A flexible double printed substrate comprising an insulating resin layer comprising low-linear expansion polyimide resin layer/thermoplastic polyimide resin layer/low-linear expansion polyimide resin layer, and a metal layer or a wiring circuit formed on each low-linear expansion polyimide resin layer, wherein a mixed region comprising low-linear expansion polyimide resin and thermoplastic polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.
A flexible double printed substrate comprising an insulating resin layer comprising a thermoplastic polyimide resin layer and a metal layer or a wiring circuit formed on both sides of the insulating resin layer, wherein the metal layers or the wiring circuits formed on both sides of the insulating layer are electrically connected by conducting paths formed by filling a metallic material in through-holes formed in the thickness direction of the thermoplastic polyimide resin layer.
A flexible printed substrate comprising an insulating resin layer and a wiring circuit, wherein said wiring circuit is embedded in the insulating resin layer.
A flexible double printed substrate comprising a thermoplastic resin layer having wiring circuits each embedded in both sides of the layer and low-linear expansion polyimide resin layers each formed on both surfaces of the thermoplastic resin layer.
Dependencies are inferred from the claim text.