H05K 3/4614
The electrical connections between the circuit boards being made during lamination
Official title: {the electrical connections between the circuit boards being made during lamination}
H05K3/4614 (The electrical connections between the circuit boards being made during lamination) appears on 1,220 US grants and 1,167 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,220
- Published applications
- 1,167
- Assignees
- 376
- Inventors
- 2,233
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 8 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 7 | 0 |
| 1993 | 10 | 0 |
| 1994 | 31 | 0 |
| 1995 | 29 | 0 |
| 1996 | 24 | 0 |
| 1997 | 15 | 0 |
| 1998 | 32 | 0 |
| 1999 | 29 | 0 |
| 2000 | 27 | 0 |
| 2001 | 37 | 21 |
| 2002 | 43 | 70 |
| 2003 | 54 | 74 |
| 2004 | 68 | 98 |
| 2005 | 56 | 70 |
| 2006 | 50 | 67 |
| 2007 | 59 | 70 |
| 2008 | 51 | 94 |
| 2009 | 25 | 73 |
| 2010 | 49 | 52 |
| 2011 | 47 | 38 |
| 2012 | 45 | 38 |
| 2013 | 38 | 22 |
| 2014 | 24 | 48 |
| 2015 | 24 | 35 |
| 2016 | 39 | 30 |
| 2017 | 42 | 22 |
| 2018 | 34 | 31 |
| 2019 | 35 | 38 |
| 2020 | 35 | 34 |
| 2021 | 23 | 29 |
| 2022 | 32 | 33 |
| 2023 | 22 | 27 |
| 2024 | 22 | 21 |
| 2025 | 19 | 17 |
| 2026 | 11 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Membrane circuit board1 Sep 2026US 12,727,079 B2Chicony Electronics Co., Ltd.
- Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor18 Aug 2026US 12,709,083 B2Resonac Corporation
- Circuit board7 Jul 2026US 12,677,381 B2Avary Holding (Shenzhen) Co., Limited.
- Circuit board with a plurality of laminated insulating layers having conductive paste filled vias and manufacturing method thereof23 Jun 2026US 12,666,546 B2Fict Limited
- Component Carrier13 Aug 2026US 2026/0239534 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit board assembly with embedded electronic devices and method for manufacturing the same6 Aug 2026US 2026/0231338 A1Avary Holding (Shenzhen) Co., Limited.
- Carrier substrate and manufacturing method thereof11 Jun 2026US 2026/0164555 A1AaltoSemi Inc.
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Resin laminated board and method for manufacturing resin laminated board26 Mar 2026US 2026/0089834 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Process for making active interposer for high performance packaging applications302US 6,461,895 B1Intel Corporation · 2002
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995